全球65万家客户选择健翔升
高多层、高精密、高可靠PCB提供商
制程能力
设备展示
HDI产品技术能力
HDI高密度互连板采用盲埋孔工艺，健翔升科技提供任意层互联HDI板制造服务，大幅提升布线密度，适用于智能手机、平板电脑等高端消费电子产品。浏览产品>
| 项目 | 2024 | 2025 | 2026 | ||||
|---|---|---|---|---|---|---|---|
| 量产 | 样品 | 量产 | 样品 | 量产 | 样品 | ||
| 层次 layer count | ≤24L | ≤36L | ≤24L | ≤36L | ≤24L | ≤36L | |
| 叠层设计 stack-up | 3+N+3 | 4+N+4 | 4+N+4 | Anylayer(10L) | Anylayer(10L) | Anylayer(12L) | |
| 尺寸Dimension(mm) | MAX | 620*725mm | 620*810mm | 620*725mm | 620*1092mm | 620*725mm | 620*1092mm |
|
成品板厚 Board thickness(mm) | MAX | 3.2mm | 4.2mm | 3.2mm | 4.2mm | 3.2mm | 4.2mm |
|
阻抗公差 Impedance tolerance | 差分Diff>50ohm | ±10% | ±7% | ±10% | ±7% | ±8% | ±7% |
| 单端 single50ohm | ±10% | ±8% | ±8% | ±6% | ±8% | ±6% | |
|
层间对准度 Layer registration | ≤12L | ≥5mil | ≥4mil | ≥5mil | ≥4mil | ≥4mil | ≥3mil |
| >12L | ≥7mil | ≥5mil | ≥6mil | ≥5mil | ≥5mil | ≥4mil | |
| N+N | ≥7mil | ≥5mil | ≥7mil | ≥5mil | ≥5mil | ≥4mil | |
|
图形精度 Pattern accuracy | 尺寸≤500mm | ±4mil | ±4mil | ≥4mil | ≥4mil | ≥4mil | ≥4mil |
| 尺寸>500mm | ±5mil | ±5mil | ≥7mil | ≥5mil | ≥5mil | ±5mil | |
| 激光盲孔能力 laser blind hole | 100/225um | 75/200um | 75/200um | 75/180um | 75/180um | 65/165um | |
| 电镀填孔凹陷 dimple | 25um | 15um | 20um | 10um | 20um | 10um | |
|
电镀纵横比(通孔) plating aspect ratio for via hole | 14:1 | 16:1 | 14:1 | 16:1 | 14:1 | 16:1 | |
|
背钻 Back-drill |
背钻直径 back-drill size (min) | 0.45mm | 0.4mm | 0.45mm | 0.4mm | 0.4mm | 0.35mm |
| STUB能力 (min) | 8mil | 6mil | 8mil | 6mil | 6mil | 5mil | |
|
背钻到铜距离 back-drill to17 copperdistance (min) | 7mil | 6mil | 7mil | 5mil | 5mil | 5mil | |
|
特殊工艺 Special technology | POFV | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes |
| N+N | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | |
|
混压 hybrid lamination | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | |
| 深微孔 blind hole | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | |
|
金属化半孔 metallized half hole | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | 具备 yes | |